Qingdao Wanguo Sanchuan Fiber Technology Co., Ltd
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Carbon Fiber Plain Weave : Precision Engineered For Extreme Environments
High-Strength Carbon Fiber Plain Weave Fabric is a cutting-edge composite material engineered for applications demanding uncompromising mechanical integrity and dimensional stability. Constructed from 12K high-modulus carbon fibers arranged in a tightly controlled plain weave pattern, this fabric delivers isotropic strength properties and exceptional resistance to thermal distortion. Its unique architecture ensures uniform load distribution, making it ideal for structural components exposed to extreme temperatures, mechanical stress, or corrosive environments.
Key Innovations:
Ultra-High Tensile Strength: Achieves 4,500 MPa longitudinal strength with 0.8% elongation at break.
Thermal Stability: Maintains structural integrity from -269°C (liquid helium) to 300°C.
Electromagnetic Interference Shielding: Provides 40 dB attenuation in EMI-prone environments.
Hybrid Resin Compatibility: Supports epoxy, cyanate ester, and polyimide resins for tailored performance.
Sustainable Production: 40% recycled carbon fiber content meets circular economy standards.
| Stage | Technical Specifications |
|---|---|
| Precursor Processing | PAN-based precursor fibers undergo stabilization (250°C) and carbonization (1,800°C) in inert gas. |
| Weaving Automation | Computer-controlled looms ensure ±0.1 mm alignment accuracy in plain weave configuration. |
| Surface Functionalization | Plasma-assisted oxidation (O₂/CF₄) enhances resin adhesion by 60%. |
| Curing Protocol | Dual-stage thermal curing: 150°C phenolic resin curing + 220°C polyimide post-curing. |
| Quality Assurance | AI-driven optical scanning detects fiber misalignment <0.05% in real time. |
Environmental Controls: Store in dry nitrogen-purged containers at 18–25°C to prevent oxidation.
Processing Temperature: Critical curing window: 145–155°C for phenolic phase; avoid >260°C to prevent delamination.
Electrostatic Precautions: Use grounded workstations and anti-static packaging during handling.
Chemical Resistance: Compatible with epoxy, PEEK, and fluoropolymers; avoid contact with amines or chlorinated solvents.
Mechanical Handling: Prohibit sharp bends or creasing to avoid fiber breakage.
| Parameter | Standard Grade | Ultra-High Temp Grade |
|---|---|---|
| Fiber Diameter | 7–10 μm | 5–8 μm |
| Tensile Strength | 4,500 MPa (longitudinal) | 5,200 MPa |
| Thermal Conductivity | 20 W/m·K | 35 W/m·K |
| Electrical Resistivity | 1.2×10⁻³ Ω·cm | 0.8×10⁻³ Ω·cm |
| Moisture Absorption | <0.3% (24h/25°C) | <0.05% |
| Flammability | UL94 V-0 | UL94 V-0 |
| Certifications | ISO 9001, REACH, RoHS | NASA-STD-6012, MIL-I-24768 |
Aerospace: Hypersonic vehicle nose cones, reusable rocket engine nozzles requiring thermal/chemical resilience.
Energy Systems: Hydrogen storage tanks, electrolyzer bipolar plates with integrated EMI shielding.
Electronics: 5G base station radomes, flexible printed circuit boards for wearable tech.
Defense: Electromagnetic warfare countermeasures, blast-resistant vehicle armor.
Industrial: Plasma reactor liners, semiconductor wafer carriers with ultra-low particulation.
